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At Eurodisplay 2026, Fraunhofer IPMS will present a new generation of full-color RGBW microdisplays based on a 28-nm CMOS process. These advanced displays are specifically designed for near-eye visualization and projection and open up numerous innovative applications.<\/p>\n
The new microdisplays are ideally suited for use in augmented reality (AR), virtual reality (VR), and mixed reality glasses. Thanks to their high resolution and efficiency, they are also excellent for wearable devices and applications that require brilliant image quality from a microdisplay with a small form factor.<\/p>\n
The displays are manufactured using a state-of-the-art 28-nm CMOS process. The flexible backplane architecture combines two drive concepts: frame-based (for continuous updates) and memory-based (for static content). Full-color RGBW pixels are generated by a white calculation block integrated into the backplane, which calculates the white subpixel from standard RGB image data. The extremely small subpixel size of 2.52 \u00d7 2.52 \u00b5m\u00b2 enables exceptionally high pixel densities of up to 5,040 PPI.<\/p>\n
\u201cCompared to conventional microdisplays, the new solution offers significantly lower power consumption and ultra-high resolution. The flexible driving modes enable both fast video playback and extremely energy-efficient display of static images, making the displays ideal for battery-powered, lightweight devices with long runtime,\u201d explains Philipp Wartenberg, Head of the IC & System Design Department at Fraunhofer IPMS.<\/p>\n
Scientists at Fraunhofer IPMS develop unique, innovative drive concepts for microdisplays\u2014for example, with extremely high pixel density\u2014and can flexibly customize display parameters and interfaces to meet specific customer requirements. The institute also offers comprehensive support\u2014ranging from technology consulting and the provision of evaluation kits to pilot production of the microdisplays. <\/p>\n
The “RUBIN EdgeVision” project is funded by the “RUBIN” (“Regional Entrepreneurial Alliances for Innovation”) funding program of the Federal Ministry of Research, Technology, and Space. (Funding Code: 03RU2U061C)
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Backplane\u2014Deep-submicron CMOS process technology for driving integrated microdisplays and signal processing circuits for optical sensors
Funding agency: Saxon State Ministry for Economic Affairs, Labor, and Transportation \u2013 Grant ID: 100392259<\/p>\n
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