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Samsung will join the industry initiative to advance next-generation 12-inch photomask technology for future manufacturing. The semiconductor industry has relied on the 6-inch photomask format for decades. With High-NA EUV, the transition to larger 12-inch masks is expected to further increase the productivity of manufacturing facilities, reduce chip manufacturing costs, and eliminate assembly constraints. This will enable advanced chip manufacturers to fully leverage the benefits of high-NA EUV, making future generations of cutting-edge chips more cost-effective.<\/p>\n
Given its leadership in both memory and foundry manufacturing, as well as its extensive experience with advanced EUV lithography, Samsung is ideally positioned to play a pivotal role in the transition to 12-inch photomasks. The company will work closely with industry partners to develop the necessary mask technologies and associated infrastructure.<\/p>\n
Samsung also plans to be the first in the industry to introduce ASML\u2019s high-NA EUV (Extreme Ultraviolet) from ASML into future DRAM mass production by 2028\u2014a first for the industry\u2014thereby once again demonstrating the suitability of high-NA technology for advanced memory and logic applications. High-NA EUV is expected to extend the scaling roadmap for DRAMs, with improved resolution enabling process simplification and increased efficiency.<\/p>\n
The announcement reflects a shared commitment to innovation, technology leadership, and long-term partnership. Samsung and ASML plan to continue exploring opportunities for collaboration in areas such as advanced memory and innovative manufacturing approaches.<\/p>\n
Young Hyun Jun, Vice Chairman and CEO of Samsung Electronics, said: \u201cThe age of AI is transforming the semiconductor industry and increasing the importance of technological innovation across the entire value chain. Samsung is committed to maintaining its leadership position in advanced semiconductor manufacturing\u2014including memory and foundry\u2014through groundbreaking technologies and strong partnerships. By further strengthening our collaboration with ASML, we are helping to lay the foundation for the next generation of AI and semiconductor innovations.”<\/p>\n
Christophe Fouquet, President and CEO of ASML, said: “Samsung has been one of ASML\u2019s most important innovation partners for many years. Together, we have helped drive the technologies that underpin modern semiconductor manufacturing. As the industry enters a new era shaped by artificial intelligence, close collaboration with our customers becomes even more important. We look forward to working with Samsung to drive the next wave of semiconductor innovation.\u201d<\/p>\n
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\ud83d\udc49 www.asml.com<\/a> Photo: unsplash<\/i><\/p>\n","protected":false},"excerpt":{"rendered":" September 8, 2026. Building on their long-standing successful collaboration, the companies will work together to advance the development and deployment of technologies that meet the growing demands for performance and efficiency in modern semiconductor manufacturing.<\/p>\n","protected":false},"author":3,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"inline_featured_image":false,"footnotes":"","_links_to":"","_links_to_target":""},"categories":[4818],"tags":[4836,1982,4783],"class_list":["post-545398","post","type-post","status-publish","format-standard","hentry","category-microelectronics","tag-production","tag-resilience","tag-semiconductors"],"acf":[],"yoast_head":"\n
\ud83d\udc49 https:\/\/semiconductor.samsung.com<\/a> <\/p>\n