{"id":542069,"date":"2026-07-13T13:13:04","date_gmt":"2026-07-13T11:13:04","guid":{"rendered":"https:\/\/silicon-saxony.de\/fraunhofer-ipms-new-generation-of-highly-sensitive-infrared-sensors-opens-up-opportunities-for-medicine-mobility-and-industrial-imaging\/"},"modified":"2026-07-13T13:13:22","modified_gmt":"2026-07-13T11:13:22","slug":"fraunhofer-ipms-new-generation-of-highly-sensitive-infrared-sensors-opens-up-opportunities-for-medicine-mobility-and-industrial-imaging","status":"publish","type":"post","link":"https:\/\/silicon-saxony.de\/en\/fraunhofer-ipms-new-generation-of-highly-sensitive-infrared-sensors-opens-up-opportunities-for-medicine-mobility-and-industrial-imaging\/","title":{"rendered":"Fraunhofer IPMS: New Generation of Highly Sensitive Infrared Sensors Opens Up Opportunities for Medicine, Mobility, and Industrial Imaging"},"content":{"rendered":"<p><img decoding=\"async\" style=\"width: 25%;\" src=\"https:\/\/cdn.pblzr.de\/dacbb27c-1270-4041-b681-e2b95f06f8a1\/2026\/07\/fraunhoferipms-logo-400x300_TEXT.jpg\"><\/p>\n<p>Thermoelectric infrared sensors enable noncontact temperature measurement and the generation of thermal images. They are already in use today in process monitoring, building automation, and security technology. However, the performance of current systems is limited by the thermocouple materials used. The new project addresses this challenge by employing significantly more efficient thermoelectric materials and a novel MEMS device concept.&nbsp;<\/p>\n<h3 class=\"\">New Applications Through Higher Sensitivity<\/h3>\n<p>The targeted improvement in temperature resolution opens up numerous new fields of application. In the medical field, future applications could be developed to support early cancer detection or the detection of externally visible inflammation. In the context of age-appropriate living, the sensors also enable new solutions, such as the reliable detection of falls or emergency situations in the home.<\/p>\n<p>Furthermore, autonomous vehicles benefit from the higher sensitivity of the sensor arrays. For industrial applications, new possibilities are opening up in thermography and process monitoring. In addition, the use of the sensors in cost-effective solutions for contactless temperature measurement opens the door to further application and market segments.&nbsp;<\/p>\n<h3 class=\"\">Fraunhofer IPMS Develops MEMS Technology for the Integration of Novel Materials<\/h3>\n<p>Fraunhofer IPMS is taking on key roles in the project related to the development of MEMS technology. This includes the integration of novel thermocouple layers, the development and optimization of the necessary manufacturing processes, and the production of demonstrator chips. In addition, strategies are being developed to integrate the new materials into the institute\u2019s 200-mm production line in the future.<\/p>\n<p>The project partners will initially demonstrate the developed technologies using passive sensor arrays. In a subsequent development phase, these will be used to create active sensor arrays with integrated CMOS drive electronics. The demonstrators developed in the project aim to achieve a technology readiness level (TRL) of 4.<\/p>\n<h3 class=\"\">About Fraunhofer IPMS<\/h3>\n<p>Fraunhofer IPMS is a leading international research and development service provider for electronic and photonic microsystems. Our technologies find applications in industry, mobility, biotechnology, and medical technology. At the same time, we address key future fields such as quantum technologies and neuromorphic computing. Through our research in the field of green microelectronics, we contribute to a resource-efficient and sustainable world. In our 200-mm cleanroom, we offer a full range of services for the development of micro-electro-mechanical systems (MEMS) and micro-opto-electro-mechanical systems (MOEMS) on 200 mm wafers\u2014all fully CMOS-compatible.&nbsp;<\/p>\n<p>&#8211; &#8211; &#8211; &#8211; &#8211;<\/p>\n<h4 class=\"\">Related Links<\/h4>\n<p>\ud83d\udc49&nbsp;<a href=\"http:\/\/www.ipms.fraunhofer.de\" target=\"_blank\">www.ipms.fraunhofer.de<\/a>&nbsp;&nbsp;<\/p>\n<p><i>Photo: Heimann Sensor<\/i><\/p>\n","protected":false},"excerpt":{"rendered":"<p>July 7, 2026. The Fraunhofer Institute for Photonic Microsystems (IPMS), in collaboration with Heimann Sensor and the Leibniz Institute for Solid State and Materials Research Dresden (IFW Dresden), is developing the technological foundation for a new generation of thermoelectric infrared sensor arrays. By integrating highly efficient thermoelectric materials into a CMOS-compatible manufacturing technology for the first time, the project aims to create significantly more powerful sensors. The goal is to achieve a temperature resolution of less than 20 millikelvin with pixel sizes of less than 45 micrometers\u2014an important step toward new applications in medicine, industry, mobility, and security.<\/p>\n","protected":false},"author":3,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"inline_featured_image":false,"footnotes":"","_links_to":"","_links_to_target":""},"categories":[4818],"tags":[1954,1986],"class_list":["post-542069","post","type-post","status-publish","format-standard","hentry","category-microelectronics","tag-research-development","tag-sensors"],"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.1.1 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Fraunhofer IPMS: New Generation of Highly Sensitive Infrared Sensors Opens Up Opportunities for Medicine, Mobility, and Industrial Imaging - Silicon Saxony<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/silicon-saxony.de\/en\/fraunhofer-ipms-new-generation-of-highly-sensitive-infrared-sensors-opens-up-opportunities-for-medicine-mobility-and-industrial-imaging\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Fraunhofer IPMS: New Generation of Highly Sensitive Infrared Sensors Opens Up Opportunities for Medicine, Mobility, and Industrial Imaging - Silicon Saxony\" \/>\n<meta property=\"og:description\" content=\"July 7, 2026. The Fraunhofer Institute for Photonic Microsystems (IPMS), in collaboration with Heimann Sensor and the Leibniz Institute for Solid State and Materials Research Dresden (IFW Dresden), is developing the technological foundation for a new generation of thermoelectric infrared sensor arrays. By integrating highly efficient thermoelectric materials into a CMOS-compatible manufacturing technology for the first time, the project aims to create significantly more powerful sensors. The goal is to achieve a temperature resolution of less than 20 millikelvin with pixel sizes of less than 45 micrometers\u2014an important step toward new applications in medicine, industry, mobility, and security.\" \/>\n<meta property=\"og:url\" content=\"https:\/\/silicon-saxony.de\/en\/fraunhofer-ipms-new-generation-of-highly-sensitive-infrared-sensors-opens-up-opportunities-for-medicine-mobility-and-industrial-imaging\/\" \/>\n<meta property=\"og:site_name\" content=\"Silicon Saxony\" \/>\n<meta property=\"article:published_time\" content=\"2026-07-13T11:13:04+00:00\" \/>\n<meta property=\"article:modified_time\" content=\"2026-07-13T11:13:22+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/cdn.pblzr.de\/dacbb27c-1270-4041-b681-e2b95f06f8a1\/2026\/07\/fraunhoferipms-logo-400x300_TEXT.jpg\" \/>\n<meta name=\"author\" content=\"publizer2silisax\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\" \/>\n\t<meta name=\"twitter:data1\" content=\"publizer2silisax\" \/>\n\t<meta name=\"twitter:label2\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data2\" content=\"2 minutes\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\/\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\/\/silicon-saxony.de\/en\/fraunhofer-ipms-new-generation-of-highly-sensitive-infrared-sensors-opens-up-opportunities-for-medicine-mobility-and-industrial-imaging\/#article\",\"isPartOf\":{\"@id\":\"https:\/\/silicon-saxony.de\/en\/fraunhofer-ipms-new-generation-of-highly-sensitive-infrared-sensors-opens-up-opportunities-for-medicine-mobility-and-industrial-imaging\/\"},\"author\":{\"name\":\"publizer2silisax\",\"@id\":\"https:\/\/silicon-saxony.de\/en\/#\/schema\/person\/098cd473f5dd7707320dd1e252e15ac6\"},\"headline\":\"Fraunhofer IPMS: New Generation of Highly Sensitive Infrared Sensors Opens Up Opportunities for Medicine, Mobility, and Industrial Imaging\",\"datePublished\":\"2026-07-13T11:13:04+00:00\",\"dateModified\":\"2026-07-13T11:13:22+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\/\/silicon-saxony.de\/en\/fraunhofer-ipms-new-generation-of-highly-sensitive-infrared-sensors-opens-up-opportunities-for-medicine-mobility-and-industrial-imaging\/\"},\"wordCount\":419,\"image\":{\"@id\":\"https:\/\/silicon-saxony.de\/en\/fraunhofer-ipms-new-generation-of-highly-sensitive-infrared-sensors-opens-up-opportunities-for-medicine-mobility-and-industrial-imaging\/#primaryimage\"},\"thumbnailUrl\":\"https:\/\/cdn.pblzr.de\/dacbb27c-1270-4041-b681-e2b95f06f8a1\/2026\/07\/fraunhoferipms-logo-400x300_TEXT.jpg\",\"keywords\":[\"Research &amp; Development\",\"Sensors\"],\"articleSection\":[\"Microelectronics\"],\"inLanguage\":\"en-US\"},{\"@type\":\"WebPage\",\"@id\":\"https:\/\/silicon-saxony.de\/en\/fraunhofer-ipms-new-generation-of-highly-sensitive-infrared-sensors-opens-up-opportunities-for-medicine-mobility-and-industrial-imaging\/\",\"url\":\"https:\/\/silicon-saxony.de\/en\/fraunhofer-ipms-new-generation-of-highly-sensitive-infrared-sensors-opens-up-opportunities-for-medicine-mobility-and-industrial-imaging\/\",\"name\":\"Fraunhofer IPMS: New Generation of Highly Sensitive Infrared Sensors Opens Up Opportunities for Medicine, Mobility, and Industrial Imaging - 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