{"id":540822,"date":"2026-05-19T14:06:20","date_gmt":"2026-05-19T12:06:20","guid":{"rendered":"https:\/\/silicon-saxony.de\/fraunhofer-ipms-apecs-and-fmd-high-density-chiplet-systems-realized-at-wafer-level\/"},"modified":"2026-05-19T14:06:20","modified_gmt":"2026-05-19T12:06:20","slug":"fraunhofer-ipms-apecs-and-fmd-high-density-chiplet-systems-realized-at-wafer-level","status":"publish","type":"post","link":"https:\/\/silicon-saxony.de\/en\/fraunhofer-ipms-apecs-and-fmd-high-density-chiplet-systems-realized-at-wafer-level\/","title":{"rendered":"Fraunhofer IPMS, APECS and FMD: High-density chiplet systems realized at wafer level"},"content":{"rendered":"<p><img decoding=\"async\" style=\"width: 25%;\" src=\"https:\/\/cdn.pblzr.de\/dacbb27c-1270-4041-b681-e2b95f06f8a1\/2026\/05\/fraunhoferipms-logo-400x300_TEXT.jpg\">&nbsp; &nbsp; &nbsp;<img decoding=\"async\" style=\"width: 25%;\" src=\"https:\/\/cdn.pblzr.de\/dacbb27c-1270-4041-b681-e2b95f06f8a1\/2026\/05\/apecs-logo-400x300_TEXT.png\">&nbsp; &nbsp; &nbsp;<img decoding=\"async\" style=\"width: 25%;\" src=\"https:\/\/cdn.pblzr.de\/dacbb27c-1270-4041-b681-e2b95f06f8a1\/2026\/05\/fmd-logo-400x300_TEXT.png\"><\/p>\n<p>The increasing demands on complexity, computing power and system compactness call for radically new approaches in semiconductor production. The vision of future-proof microelectronics envisages systems that are as powerful as a single chip but offer the flexibility of a modular system. Within APECS, the pilot line for &#8220;Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems&#8221;, Fraunhofer IPMS is therefore pursuing the approach of quasi-monolithic integration (QMI): The aim is to combine different chip components such as control electronics, sensors or micro-electromechanical components (MEMS) at wafer level so efficiently that the advantages of a compact single chip are retained.<\/p>\n<h3 class=\"\">From theory to reality: pockets, placement and embedding<\/h3>\n<p>Researchers at Fraunhofer IPMS have now successfully demonstrated the first critical milestone of the QMI roadmap. &#8220;The basis of QMI are silicon wafers with structured recesses (pockets). Dummy chiplets were inserted into these so-called pocket wafers for the first time and the surface was leveled with a passivation layer for the subsequent backend-of-line wiring,&#8221; explains Dr. Lukas Lorenz, group manager at Fraunhofer IPMS. &#8220;This creates an almost monolithic system architecture that combines maximum integration density with modular expandability.&#8221; This success paves the way for the industrial maturity of the entire process chain for future industrial applications.&nbsp;<\/p>\n<h3 class=\"\">Technological advantages: Higher system performance with maximum compactness<\/h3>\n<p>QMI technology offers significant advantages over conventional packaging processes. The basis for this is the arrangement of the chiplets on an active or passive wafer substrate with a common interconnect stack. As contacting then takes place within the front-end line, much higher connection densities can be achieved than with conventional methods. This leads to the following added values:<\/p>\n<ul>\n<li>Higher performance: Shortened signal paths reduce losses and latencies and increase processing speed at system level.<\/li>\n<li>Reliability: The reduction of mechanical interfaces increases the robustness and service life of the systems.<\/li>\n<li>Compactness: QMI saves a considerable amount of space as the elements are integrated almost monolithically.<\/li>\n<li>Cost efficiency: The combination of modular chiplet approaches enables maximum economic integration with short innovation cycles and high scalability.<\/li>\n<\/ul>\n<p>These advantages predestine quasi-monolithic integration for innovations such as highly integrated SoC (system-on-chip) for AI applications (sensor AI) and intelligent transceivers with high bandwidth.&nbsp;<\/p>\n<h3 class=\"\">Outlook: Industrial application<\/h3>\n<p>Dr. Lukas Lorenz emphasizes: &#8220;Although the current demonstrator is based on dummy structures, the process chain can be transferred to real customer applications. This enables a scalable integration architecture for future heterogeneous system solutions.&#8221; Fraunhofer IPMS is thus addressing industrial partners whose products can benefit from the high-density integration of different technologies. The approaches developed as part of APECS thus form the basis for transferring QMI to product-related manufacturing environments in the near future. Further information is available on the Fraunhofer IPMS website.<\/p>\n<p>APECS is co-funded by Chips Joint Undertaking and by national funding from Austria, Belgium, Finland, France, Germany, Greece, Portugal and Spain as part of the &#8220;Chips for Europe&#8221; initiative. The total funding for the APECS pilot line amounts to 730 million euros over 4.5 years.<\/p>\n<h3 class=\"\">About Fraunhofer IPMS<\/h3>\n<p>Fraunhofer IPMS is a leading international research and development service provider for electronic and photonic microsystems. Our technologies are used in industry, mobility, biotechnology and medical technology. At the same time, we address key future fields such as quantum technologies and neuromorphic computing. With our research in the field of green microelectronics, we contribute to a resource-saving and sustainable world. The Fraunhofer Institute is a member of the Research Fab Microelectronics Germany (FMD).<\/p>\n<h3 class=\"\">About the APECS pilot line<\/h3>\n<p>With APECS, the Research Fab Microelectronics Germany (FMD) is building a comprehensive pilot line for resilient and trustworthy heterogeneous systems over the coming years as part of the EU Chips Act, which will promote the innovative capacity of European industry across the board. By enabling new functionalities through System Technology Co-Optimization (STCO), end-to-end design and pilot production capabilities, the pilot line will enable innovation to evolve from research to practical, scalable manufacturing solutions. In addition, APECS offers a one-stop store for customers in virtually all traditional industry verticals, including large enterprises, SMEs and start-ups. APECS brings together the expertise, infrastructure and know-how of ten partners from eight European countries. In Germany, twelve institutes of the Fraunhofer-Gesellschaft (project coordinator) and two institutes of the Leibniz Association are involved in the pilot line.<\/p>\n<h3 class=\"\">About the Research Fab Microelectronics Germany (FMD)<\/h3>\n<p>The Research Fab Microelectronics Germany (FMD) as a cooperation of 13 Fraunhofer Institutes with the Leibniz Institutes FBH and IHP is the central point of contact for all issues relating to micro- and nanoelectronic research and development in Germany and Europe. As a one-stop store, the FMD combines scientifically excellent technologies and system solutions from its cooperating institutes into a customer-specific overall offering.<\/p>\n<p>&#8211; &#8211; &#8211; &#8211; &#8211; &#8211;<\/p>\n<h4 class=\"\">Further links<\/h4>\n<p>\ud83d\udc49&nbsp;<a href=\"http:\/\/www.ipms.fraunhofer.de\" target=\"_blank\">www.ipms.fraunhofer.de<\/a>&nbsp;&nbsp;<br \/>\ud83d\udc49&nbsp;<a href=\"http:\/\/www.apecs.eu\" target=\"_blank\">www.apecs.eu<\/a>&nbsp;<br \/>\ud83d\udc49&nbsp;<a href=\"http:\/\/www.forschungsfabrik-mikroelektronik.de\" target=\"_blank\">www.forschungsfabrik-mikroelektronik.de<\/a>&nbsp;<\/p>\n<p><i>Photo: Fraunhofer IPMS<\/i><\/p>\n","protected":false},"excerpt":{"rendered":"<p>May 19, 2026. Breakthrough in chip production: As part of the European pilot line APECS, the Fraunhofer Institute for Photonic Microsystems IPMS has developed a method that fuses various chip components almost seamlessly into a single unit. By precisely embedding small chiplets in special silicon pockets, it has been possible for the first time to combine the advantages of a compact single chip with the flexibility of modular systems. This success proves the feasibility of so-called quasi-monolithic integration (QMI) and closes the gap between classic chip packaging and state-of-the-art semiconductor production.<\/p>\n","protected":false},"author":3,"featured_media":0,"comment_status":"","ping_status":"","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"inline_featured_image":false,"footnotes":"","_links_to":"","_links_to_target":""},"categories":[4818],"tags":[1954,1960],"class_list":["post-540822","post","type-post","status-publish","format-standard","hentry","category-microelectronics","tag-research-development","tag-semiconductor"],"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.1.1 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Fraunhofer IPMS, APECS and FMD: High-density chiplet systems realized at wafer level - Silicon Saxony<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/silicon-saxony.de\/en\/fraunhofer-ipms-apecs-and-fmd-high-density-chiplet-systems-realized-at-wafer-level\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Fraunhofer IPMS, APECS and FMD: High-density chiplet systems realized at wafer level - Silicon Saxony\" \/>\n<meta property=\"og:description\" content=\"May 19, 2026. Breakthrough in chip production: As part of the European pilot line APECS, the Fraunhofer Institute for Photonic Microsystems IPMS has developed a method that fuses various chip components almost seamlessly into a single unit. By precisely embedding small chiplets in special silicon pockets, it has been possible for the first time to combine the advantages of a compact single chip with the flexibility of modular systems. This success proves the feasibility of so-called quasi-monolithic integration (QMI) and closes the gap between classic chip packaging and state-of-the-art semiconductor production.\" \/>\n<meta property=\"og:url\" content=\"https:\/\/silicon-saxony.de\/en\/fraunhofer-ipms-apecs-and-fmd-high-density-chiplet-systems-realized-at-wafer-level\/\" \/>\n<meta property=\"og:site_name\" content=\"Silicon Saxony\" \/>\n<meta property=\"article:published_time\" content=\"2026-05-19T12:06:20+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/cdn.pblzr.de\/dacbb27c-1270-4041-b681-e2b95f06f8a1\/2026\/05\/fraunhoferipms-logo-400x300_TEXT.jpg\" \/>\n<meta name=\"author\" content=\"publizer2silisax\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\" \/>\n\t<meta name=\"twitter:data1\" content=\"publizer2silisax\" \/>\n\t<meta name=\"twitter:label2\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data2\" content=\"4 minutes\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\/\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\/\/silicon-saxony.de\/en\/fraunhofer-ipms-apecs-and-fmd-high-density-chiplet-systems-realized-at-wafer-level\/#article\",\"isPartOf\":{\"@id\":\"https:\/\/silicon-saxony.de\/en\/fraunhofer-ipms-apecs-and-fmd-high-density-chiplet-systems-realized-at-wafer-level\/\"},\"author\":{\"name\":\"publizer2silisax\",\"@id\":\"https:\/\/silicon-saxony.de\/en\/#\/schema\/person\/098cd473f5dd7707320dd1e252e15ac6\"},\"headline\":\"Fraunhofer IPMS, APECS and FMD: High-density chiplet systems realized at wafer level\",\"datePublished\":\"2026-05-19T12:06:20+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\/\/silicon-saxony.de\/en\/fraunhofer-ipms-apecs-and-fmd-high-density-chiplet-systems-realized-at-wafer-level\/\"},\"wordCount\":817,\"image\":{\"@id\":\"https:\/\/silicon-saxony.de\/en\/fraunhofer-ipms-apecs-and-fmd-high-density-chiplet-systems-realized-at-wafer-level\/#primaryimage\"},\"thumbnailUrl\":\"https:\/\/cdn.pblzr.de\/dacbb27c-1270-4041-b681-e2b95f06f8a1\/2026\/05\/fraunhoferipms-logo-400x300_TEXT.jpg\",\"keywords\":[\"Research &amp; 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