![](\"https:\/\/cdn.pblzr.de\/dacbb27c-1270-4041-b681-e2b95f06f8a1\/2026\/05\/globalfoundries-logo-400x300_TEXT.jpg\"){kind=logo}
<\/p>\n<\/p>\n
Based on GF’s advanced silicon photonics technology, the SCALE-CPO solution leverages both coarse and dense wavelength division multiplexing (CWDM, DWDM) for bidirectional data transmission over any fiber, achieving significant improvements in bandwidth density and system scalability over traditional copper links. GF has already demonstrated 8\u03bb- and 16\u03bb-bidirectional DWDM natively on its platform – a fundamental technology milestone that puts GF in a unique position to support the industry shift to CPO and accelerate the adoption of optical scale-up interconnects.<\/p>\n
GF’s SCALE CPO solution and silicon photonics technology offer an advanced portfolio of fully qualified photonic devices, such as 50 Gbps and 100 Gbps microring modulators, coupled ring resonators and integrated photodiodes. Other features include through-silicon vias (TSVs) for high-speed signal transmission and power supply, and copper pad pitches from 110 \u03bcm to under 45 \u03bcm for 2.5D\/3D stacking of organic substrates on silicon interposers, enabling customers to quickly move from design to volume production. The platform integrates electrical ICs on advanced single-digit nodes, enabling optimization between best-in-class computing power and state-of-the-art optics without compromising performance. While GF offers multiple approaches to fiber connectivity, the SCALE solution leverages broadband, removable fiber with flat insertion loss across the entire CWDM spectrum to enable future-proof scaling from 4\u03bb in each direction to 8\u03bb and beyond, while ensuring serviceability and testability of known-good-dies for next-generation AI interconnects.<\/p>\n
“With over a decade of innovation and manufacturing expertise in silicon photonics technology, GF is poised to unlock the future of high-bandwidth, energy-efficient connectivity with our SCALE solution for co-packaged optics,” said Mike Hogan, Chief Business Officer at GF. “Already today, our technology is exceeding the requirements of the OCI MSA, demonstrating our close collaboration with industry leaders and the readiness of our technology to scale next-generation AI infrastructure. “<\/p>\n
GlobalFoundries (GF) is a leading manufacturer of essential semiconductors that enable AI at scale from the cloud to the physical world. Through close partnerships with customers, GF delivers differentiated, energy-efficient, high-performance solutions for automotive, aerospace and defense, data centers, smart mobile devices, the Internet of Things and other high-growth markets. With global manufacturing facilities in the US, Europe and Asia, GF is a trusted and holistic technology partner for customers around the world. GF’s talented global team focuses on safety, durability and sustainability every day. <\/p>\n
– – – – – –<\/p>\n