The TDM24745T is a new OptiMOS\u2122 quad\u2011phase power module designed to meet the rapidly growing power requirements of next\u2011generation AI accelerators. Integrating four power stages, a TLVR inductor and decoupling capacitors into a compact 9 x 10 x 5 mm\u00b3 package. The module delivers industry\u2011leading current density exceeding 2 A\/mm\u00b2. This combination enables exceptional transient performance and supports the high\u2011current core rails required by advanced GPU and AI processors, in lateral as well as vertical power delivery configurations.\n<\/p>\n<\/p>\n
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\u201cAs AI workloads scale at unprecedented speed, the need for highly efficient and extremely compact power delivery has never been greater,\u201d said Athar Zaidi, Senior Vice President and General Manager Power ICs and Connectivity, at Infineon. \u201cWith the TDM24745T, we are redefining what is possible in high\u2011current voltage regulation. By combining industry\u2011leading current density with TLVR technology in an exceptionally small footprint, we enable our customers to unlock more compute performance, reduce energy consumption, and accelerate the deployment of next\u2011generation AI data centers.\u201d\n<\/p>\n
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As the power requirements of AI data centers continue to rise, power architectures must become more compact, responsive and efficient. The TDM24745T addresses these challenges by simplifying power architecture design, enabling higher power density to free up PCB space for additional compute resources, and delivering an extremely fast transient response. The TLVR architecture can also reduce the required output capacitance by up to 50 percent, helping system designers achieve more efficient, space\u2011saving layouts that directly contribute to energy savings and improved TCO across AI server platforms.\n<\/p>\n
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As the industry\u2019s first TLVR quad\u2011phase module in this compact form factor, the TDM24745T offers up to 320 A peak current capability, making it especially well-suited for next\u2011generation AI processors and high\u2011current multiprocessor platforms. Combined with Infineon\u2019s digital multiphase controllers, the module supports flexible and scalable architectures that accelerate system deployment in fast\u2011evolving AI environments. Powered by OptiMOS\u20116 MOSFET technology, chip\u2011embedded integration and proprietary magnetics, it delivers improved efficiency and thermal performance even in the densest AI server designs, contributing to the development of more energy efficient AI factories.\n<\/p>\n
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The TDM24745T power module integrates seamlessly into Infineon\u2019s end\u2011to\u2011end AI server power delivery ecosystem, which spans everything from the grid interface to the core processor rails. Leveraging the combined benefits of silicon (Si), silicon carbide (SiC) and gallium nitride (GaN) technologies, Infineon offers a comprehensive and scalable approach to achieving the highest efficiency, robustness and power density for AI\u2011optimized data center architectures. <\/p>\n
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Availability
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Further information is available at TDM24745T OptiMOS quad-phase power module <\/p>\n
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Infineon AI Day Taiwan
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The Infineon We Power AI Day is an industry event for business and technology leaders in Taiwan. Together with our ecosystem partners and customers, we explore the latest advances in the field of power technologies. The goal is a sustainable AI infrastructure enabled by Infineon\u2019s innovative solutions \u2013 from grid to core. The event will take place in Taipei on March 31.<\/p>\n