{"id":535604,"date":"2026-01-26T14:52:47","date_gmt":"2026-01-26T13:52:47","guid":{"rendered":"https:\/\/silicon-saxony.de\/fablink-6-2-a-major-step-forward-for-secure-and-high-performance-semiconductor-integration\/"},"modified":"2026-01-26T14:52:47","modified_gmt":"2026-01-26T13:52:47","slug":"fablink-6-2-a-major-step-forward-for-secure-and-high-performance-semiconductor-integration","status":"publish","type":"post","link":"https:\/\/silicon-saxony.de\/en\/fablink-6-2-a-major-step-forward-for-secure-and-high-performance-semiconductor-integration\/","title":{"rendered":"FabLink\u00ae 6.2: A Major Step Forward for Secure and High-Performance Semiconductor Integration"},"content":{"rendered":"<p>With <a href=\"https:\/\/kontron-ais.com\/en\/products\/fablink\" target=\"_blank\">FabLink<\/a><sup><a href=\"https:\/\/kontron-ais.com\/en\/products\/fablink\" target=\"_blank\">\u00ae<\/a><\/sup><a href=\"https:\/\/kontron-ais.com\/en\/products\/fablink\" target=\"_blank\"> 6.2<\/a>, we introduce the next evolutionary stage of our proven integration solution. This release focuses on comprehensive cybersecurity enhancements, particularly addressing the requirements of the Cyber Resilience Act (CRA). As a result, FabLink<sup>\u00ae<\/sup> continues to provide a robust, compliant, and future-ready foundation for deployment in highly complex semiconductor manufacturing environments.<\/p>\n<p>As part of version 6.2, the technological foundation has been thoroughly modernized. All dependencies have been updated to the latest versions, the core software has been upgraded to VAC 5.4, and support for key industry standards has been strategically extended. These include, among others:<\/p>\n<ul>\n<li><a href=\"https:\/\/kontron-ais.com\/en\/resources\/semi-standards\/semi-e148\" target=\"_blank\">E148 \u2013 Time Synchronization and TS-Clock<\/a><\/li>\n<li><a href=\"https:\/\/kontron-ais.com\/en\/resources\/semi-standards\/semi-e172\" target=\"_blank\">E172 \u2013 SECS Equipment Data Dictionary<\/a><\/li>\n<li><a href=\"https:\/\/kontron-ais.com\/en\/resources\/semi-standards\/semi-e187\" target=\"_blank\">E187 \u2013 Cybersecurity of Fab Equipment<\/a><\/li>\n<li><a href=\"https:\/\/kontron-ais.com\/en\/resources\/semi-standards\/semi-e188\" target=\"_blank\">E188 \u2013 Malware-Free Equipment Integration<\/a><\/li>\n<li><a href=\"https:\/\/kontron-ais.com\/en\/resources\/semi-standards\/semi-e191\" target=\"_blank\">E191 \u2013 Cybersecurity Status Reporting<\/a><\/li>\n<\/ul>\n<p>FabLink<sup>\u00ae<\/sup> 6.2 also sets new benchmarks on a technological level. Migrating the runtime to a 64-bit architecture delivers a significant performance boost. In addition, the FabLink Client has been upgraded to .NET 8 and .NET 10 and is now available for Linux environments for the first time.<\/p>\n<p><a href=\"https:\/\/kontron-ais.com\/en\/products\/fablink#c836\" target=\"_blank\">Would you like to learn how FabLink<\/a><sup><a href=\"https:\/\/kontron-ais.com\/en\/products\/fablink#c836\" target=\"_blank\">\u00ae<\/a><\/sup><a href=\"https:\/\/kontron-ais.com\/en\/products\/fablink#c836\" target=\"_blank\"> securely and efficiently integrates your SEMI-compliant interface?  Contact us to learn more about the solution.<\/a><\/p>\n<p><\/p>\n<p><\/p>\n","protected":false},"excerpt":{"rendered":"<p>With FabLink\u00ae 6.2, we introduce the next evolutionary stage of our proven integration solution. This release focuses on comprehensive cybersecurity enhancements, particularly addressing the requirements of the Cyber Resilience Act (CRA). As a result, FabLink\u00ae continues to provide a robust, compliant, and future-ready foundation for deployment in highly complex semiconductor manufacturing environments. As part of&#8230;<\/p>\n","protected":false},"author":3,"featured_media":0,"comment_status":"","ping_status":"","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"inline_featured_image":false,"footnotes":"","_links_to":"","_links_to_target":""},"categories":[4764],"tags":[11381,4842,11425,1942,2043,250,2010,11369,1960],"class_list":["post-535604","post","type-post","status-publish","format-standard","hentry","category-software-en","tag-automation","tag-connectivity","tag-customized-software","tag-data-security","tag-digitalization","tag-it","tag-manufacturing","tag-programming-software","tag-semiconductor"],"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.1.1 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>FabLink\u00ae 6.2: A Major Step Forward for Secure and High-Performance Semiconductor Integration - Silicon Saxony<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/silicon-saxony.de\/en\/fablink-6-2-a-major-step-forward-for-secure-and-high-performance-semiconductor-integration\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"FabLink\u00ae 6.2: A Major Step Forward for Secure and High-Performance Semiconductor Integration - Silicon Saxony\" \/>\n<meta property=\"og:description\" content=\"With FabLink\u00ae 6.2, we introduce the next evolutionary stage of our proven integration solution. 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As part of...\" \/>\n<meta property=\"og:url\" content=\"https:\/\/silicon-saxony.de\/en\/fablink-6-2-a-major-step-forward-for-secure-and-high-performance-semiconductor-integration\/\" \/>\n<meta property=\"og:site_name\" content=\"Silicon Saxony\" \/>\n<meta property=\"article:published_time\" content=\"2026-01-26T13:52:47+00:00\" \/>\n<meta name=\"author\" content=\"publizer2silisax\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\" \/>\n\t<meta name=\"twitter:data1\" content=\"publizer2silisax\" \/>\n\t<meta name=\"twitter:label2\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data2\" content=\"1 minute\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\/\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\/\/silicon-saxony.de\/en\/fablink-6-2-a-major-step-forward-for-secure-and-high-performance-semiconductor-integration\/#article\",\"isPartOf\":{\"@id\":\"https:\/\/silicon-saxony.de\/en\/fablink-6-2-a-major-step-forward-for-secure-and-high-performance-semiconductor-integration\/\"},\"author\":{\"name\":\"publizer2silisax\",\"@id\":\"https:\/\/silicon-saxony.de\/en\/#\/schema\/person\/098cd473f5dd7707320dd1e252e15ac6\"},\"headline\":\"FabLink\u00ae 6.2: A Major Step Forward for Secure and High-Performance Semiconductor Integration\",\"datePublished\":\"2026-01-26T13:52:47+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\/\/silicon-saxony.de\/en\/fablink-6-2-a-major-step-forward-for-secure-and-high-performance-semiconductor-integration\/\"},\"wordCount\":193,\"keywords\":[\"Automation\",\"Connectivity\",\"Customized software\",\"Data Security\",\"Digitalization\",\"IT\",\"Manufacturing\",\"Programming software\",\"Semiconductor\"],\"articleSection\":[\"Software\"],\"inLanguage\":\"en-US\"},{\"@type\":\"WebPage\",\"@id\":\"https:\/\/silicon-saxony.de\/en\/fablink-6-2-a-major-step-forward-for-secure-and-high-performance-semiconductor-integration\/\",\"url\":\"https:\/\/silicon-saxony.de\/en\/fablink-6-2-a-major-step-forward-for-secure-and-high-performance-semiconductor-integration\/\",\"name\":\"FabLink\u00ae 6.2: A Major Step Forward for Secure and High-Performance Semiconductor Integration - 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Semiconductors, Software, Robotics\",\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\/\/silicon-saxony.de\/en\/?s={search_term_string}\"},\"query-input\":{\"@type\":\"PropertyValueSpecification\",\"valueRequired\":true,\"valueName\":\"search_term_string\"}}],\"inLanguage\":\"en-US\"},{\"@type\":\"Person\",\"@id\":\"https:\/\/silicon-saxony.de\/en\/#\/schema\/person\/098cd473f5dd7707320dd1e252e15ac6\",\"name\":\"publizer2silisax\",\"image\":{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\/\/silicon-saxony.de\/en\/#\/schema\/person\/image\/\",\"url\":\"https:\/\/secure.gravatar.com\/avatar\/c4acbd63e28aa0bc7909adc90d5ef38c3fdb5e4c7922782d8eca389d00ffbd0d?s=96&d=mm&r=g\",\"contentUrl\":\"https:\/\/secure.gravatar.com\/avatar\/c4acbd63e28aa0bc7909adc90d5ef38c3fdb5e4c7922782d8eca389d00ffbd0d?s=96&d=mm&r=g\",\"caption\":\"publizer2silisax\"},\"url\":\"https:\/\/silicon-saxony.de\/en\/author\/publizer2silisax\/\"}]}<\/script>\n<!-- \/ Yoast SEO plugin. -->","yoast_head_json":{"title":"FabLink\u00ae 6.2: A Major Step Forward for Secure and High-Performance Semiconductor Integration - Silicon Saxony","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/silicon-saxony.de\/en\/fablink-6-2-a-major-step-forward-for-secure-and-high-performance-semiconductor-integration\/","og_locale":"en_US","og_type":"article","og_title":"FabLink\u00ae 6.2: A Major Step Forward for Secure and High-Performance Semiconductor Integration - Silicon Saxony","og_description":"With FabLink\u00ae 6.2, we introduce the next evolutionary stage of our proven integration solution. This release focuses on comprehensive cybersecurity enhancements, particularly addressing the requirements of the Cyber Resilience Act (CRA). As a result, FabLink\u00ae continues to provide a robust, compliant, and future-ready foundation for deployment in highly complex semiconductor manufacturing environments. As part of...","og_url":"https:\/\/silicon-saxony.de\/en\/fablink-6-2-a-major-step-forward-for-secure-and-high-performance-semiconductor-integration\/","og_site_name":"Silicon Saxony","article_published_time":"2026-01-26T13:52:47+00:00","author":"publizer2silisax","twitter_card":"summary_large_image","twitter_misc":{"Written by":"publizer2silisax","Est. reading time":"1 minute"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"Article","@id":"https:\/\/silicon-saxony.de\/en\/fablink-6-2-a-major-step-forward-for-secure-and-high-performance-semiconductor-integration\/#article","isPartOf":{"@id":"https:\/\/silicon-saxony.de\/en\/fablink-6-2-a-major-step-forward-for-secure-and-high-performance-semiconductor-integration\/"},"author":{"name":"publizer2silisax","@id":"https:\/\/silicon-saxony.de\/en\/#\/schema\/person\/098cd473f5dd7707320dd1e252e15ac6"},"headline":"FabLink\u00ae 6.2: A Major Step Forward for Secure and High-Performance Semiconductor Integration","datePublished":"2026-01-26T13:52:47+00:00","mainEntityOfPage":{"@id":"https:\/\/silicon-saxony.de\/en\/fablink-6-2-a-major-step-forward-for-secure-and-high-performance-semiconductor-integration\/"},"wordCount":193,"keywords":["Automation","Connectivity","Customized software","Data Security","Digitalization","IT","Manufacturing","Programming software","Semiconductor"],"articleSection":["Software"],"inLanguage":"en-US"},{"@type":"WebPage","@id":"https:\/\/silicon-saxony.de\/en\/fablink-6-2-a-major-step-forward-for-secure-and-high-performance-semiconductor-integration\/","url":"https:\/\/silicon-saxony.de\/en\/fablink-6-2-a-major-step-forward-for-secure-and-high-performance-semiconductor-integration\/","name":"FabLink\u00ae 6.2: A Major Step Forward for Secure and High-Performance Semiconductor Integration - Silicon Saxony","isPartOf":{"@id":"https:\/\/silicon-saxony.de\/en\/#website"},"datePublished":"2026-01-26T13:52:47+00:00","author":{"@id":"https:\/\/silicon-saxony.de\/en\/#\/schema\/person\/098cd473f5dd7707320dd1e252e15ac6"},"breadcrumb":{"@id":"https:\/\/silicon-saxony.de\/en\/fablink-6-2-a-major-step-forward-for-secure-and-high-performance-semiconductor-integration\/#breadcrumb"},"inLanguage":"en-US","potentialAction":[{"@type":"ReadAction","target":["https:\/\/silicon-saxony.de\/en\/fablink-6-2-a-major-step-forward-for-secure-and-high-performance-semiconductor-integration\/"]}]},{"@type":"BreadcrumbList","@id":"https:\/\/silicon-saxony.de\/en\/fablink-6-2-a-major-step-forward-for-secure-and-high-performance-semiconductor-integration\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https:\/\/silicon-saxony.de\/en\/home\/"},{"@type":"ListItem","position":2,"name":"FabLink\u00ae 6.2: A Major Step Forward for Secure and High-Performance Semiconductor Integration"}]},{"@type":"WebSite","@id":"https:\/\/silicon-saxony.de\/en\/#website","url":"https:\/\/silicon-saxony.de\/en\/","name":"Silicon Saxony","description":"Germany&#039;s Hightech Network - Semiconductors, Software, Robotics","potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/silicon-saxony.de\/en\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"en-US"},{"@type":"Person","@id":"https:\/\/silicon-saxony.de\/en\/#\/schema\/person\/098cd473f5dd7707320dd1e252e15ac6","name":"publizer2silisax","image":{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/silicon-saxony.de\/en\/#\/schema\/person\/image\/","url":"https:\/\/secure.gravatar.com\/avatar\/c4acbd63e28aa0bc7909adc90d5ef38c3fdb5e4c7922782d8eca389d00ffbd0d?s=96&d=mm&r=g","contentUrl":"https:\/\/secure.gravatar.com\/avatar\/c4acbd63e28aa0bc7909adc90d5ef38c3fdb5e4c7922782d8eca389d00ffbd0d?s=96&d=mm&r=g","caption":"publizer2silisax"},"url":"https:\/\/silicon-saxony.de\/en\/author\/publizer2silisax\/"}]}},"_links":{"self":[{"href":"https:\/\/silicon-saxony.de\/en\/wp-json\/wp\/v2\/posts\/535604","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/silicon-saxony.de\/en\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/silicon-saxony.de\/en\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/silicon-saxony.de\/en\/wp-json\/wp\/v2\/users\/3"}],"replies":[{"embeddable":true,"href":"https:\/\/silicon-saxony.de\/en\/wp-json\/wp\/v2\/comments?post=535604"}],"version-history":[{"count":0,"href":"https:\/\/silicon-saxony.de\/en\/wp-json\/wp\/v2\/posts\/535604\/revisions"}],"wp:attachment":[{"href":"https:\/\/silicon-saxony.de\/en\/wp-json\/wp\/v2\/media?parent=535604"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/silicon-saxony.de\/en\/wp-json\/wp\/v2\/categories?post=535604"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/silicon-saxony.de\/en\/wp-json\/wp\/v2\/tags?post=535604"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}