{"id":456193,"date":"2025-04-15T10:47:56","date_gmt":"2025-04-15T08:47:56","guid":{"rendered":"https:\/\/silicon-saxony.de\/alixlabs-aps-demonstrated-on-300-millimeter-umc-wafers\/"},"modified":"2025-04-15T10:47:56","modified_gmt":"2025-04-15T08:47:56","slug":"alixlabs-aps-demonstrated-on-300-millimeter-umc-wafers","status":"publish","type":"post","link":"https:\/\/silicon-saxony.de\/en\/alixlabs-aps-demonstrated-on-300-millimeter-umc-wafers\/","title":{"rendered":"AlixLabs: APS\u2122 demonstrated on 300-millimeter UMC wafers"},"content":{"rendered":"<p><img decoding=\"async\" style=\"width: 25%;\" src=\"https:\/\/cdn.pblzr.de\/dacbb27c-1270-4041-b681-e2b95f06f8a1\/2025\/04\/alixlabs-logo-400x300_TEXT.jpg\"><\/p>\n<p>The APS\u2122 technology was tested on 300-millimeter wafers from United Microelectronics Corporation (UMC) and successfully halved the pitch compared to current industry benchmarks. This significant advance was achieved entirely without the use of expensive and energy-intensive extreme ultraviolet (EUV) lithography.<\/p>\n<p>Instead, APS\u2122 utilizes advanced etching techniques that significantly improve sustainability and dramatically reduce power consumption without compromising throughput. Previous demonstrations of the APS\u2122 process, validated by the Intel Test Vehicle Program[1], confirmed its potential by achieving metal gaps as small as 25 nanometers.<\/p>\n<p>&#8220;Today we provide further proof that the APS\u2122 process can be game-changing for leading foundries. Thanks to UMC, we were able to verify our process on production wafers that are shipped in quantities of millions of wafers per year,&#8221; said Dr. Robin Athle, lead researcher at AlixLabs. &#8220;Our mission is to develop equipment that enables companies that do not have access to EUV tools to scale down their production to 5 nanometers and below. By eliminating the reliance on EUV lithography, we offer the industry a path to more sustainable and economically feasible high-density chip production.&#8221;<\/p>\n<p>&#8211; &#8211; &#8211; &#8211; &#8211;<\/p>\n<h4 class=\"\">Further links<\/h4>\n<p><a href=\"http:\/\/www.alixlabs.com\" target=\"_blank\">\ud83d\udc49 www.alixlabs.com<\/a>&nbsp; <br \/>\ud83d\udc49 <a href=\"http:\/\/www.alixlabs.com\/2025\/02\/07\/alixlabs-to-showcase-latest-aps-findings-at-spie-advanced-lithography-patterning\/\" target=\"_blank\">www.alixlabs.com\/2025\/02\/07\/alixlabs-to-showcase-latest-aps-findings-at-spie-advanced-lithography-patterning\/<\/a>&nbsp; <\/p>\n<p><i>Photo: AlixLabs<\/i><\/p>\n","protected":false},"excerpt":{"rendered":"<p>April 10, 2025. AlixLabs AB, a Swedish semiconductor startup specializing in Atomic Layer Etching (ALE), today unveils the latest development in its groundbreaking product line for advanced chip manufacturing and presents additional research results on its novel semiconductor manufacturing process called APS\u2122 (Atomic Layer Etching Pitch Splitting), which is capable of doubling fin density while offering unprecedented flexibility in varying pitch and critical dimensions within the same wafer area.<\/p>\n","protected":false},"author":3,"featured_media":0,"comment_status":"","ping_status":"","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"inline_featured_image":false,"footnotes":"","_links_to":"","_links_to_target":""},"categories":[4818],"tags":[1972,2012,4836,4783],"class_list":["post-456193","post","type-post","status-publish","format-standard","hentry","category-microelectronics","tag-nanoelectronics","tag-process-technologies","tag-production","tag-semiconductors"],"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.1.1 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>AlixLabs: APS\u2122 demonstrated on 300-millimeter UMC wafers - Silicon Saxony<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/silicon-saxony.de\/en\/alixlabs-aps-demonstrated-on-300-millimeter-umc-wafers\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"AlixLabs: APS\u2122 demonstrated on 300-millimeter UMC wafers - Silicon Saxony\" \/>\n<meta property=\"og:description\" content=\"April 10, 2025. AlixLabs AB, a Swedish semiconductor startup specializing in Atomic Layer Etching (ALE), today unveils the latest development in its groundbreaking product line for advanced chip manufacturing and presents additional research results on its novel semiconductor manufacturing process called APS\u2122 (Atomic Layer Etching Pitch Splitting), which is capable of doubling fin density while offering unprecedented flexibility in varying pitch and critical dimensions within the same wafer area.\" \/>\n<meta property=\"og:url\" content=\"https:\/\/silicon-saxony.de\/en\/alixlabs-aps-demonstrated-on-300-millimeter-umc-wafers\/\" \/>\n<meta property=\"og:site_name\" content=\"Silicon Saxony\" \/>\n<meta property=\"article:published_time\" content=\"2025-04-15T08:47:56+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/cdn.pblzr.de\/dacbb27c-1270-4041-b681-e2b95f06f8a1\/2025\/04\/alixlabs-logo-400x300_TEXT.jpg\" \/>\n<meta name=\"author\" content=\"publizer2silisax\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\" \/>\n\t<meta name=\"twitter:data1\" content=\"publizer2silisax\" \/>\n\t<meta name=\"twitter:label2\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data2\" content=\"1 minute\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\/\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\/\/silicon-saxony.de\/en\/alixlabs-aps-demonstrated-on-300-millimeter-umc-wafers\/#article\",\"isPartOf\":{\"@id\":\"https:\/\/silicon-saxony.de\/en\/alixlabs-aps-demonstrated-on-300-millimeter-umc-wafers\/\"},\"author\":{\"name\":\"publizer2silisax\",\"@id\":\"https:\/\/silicon-saxony.de\/en\/#\/schema\/person\/098cd473f5dd7707320dd1e252e15ac6\"},\"headline\":\"AlixLabs: APS\u2122 demonstrated on 300-millimeter UMC wafers\",\"datePublished\":\"2025-04-15T08:47:56+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\/\/silicon-saxony.de\/en\/alixlabs-aps-demonstrated-on-300-millimeter-umc-wafers\/\"},\"wordCount\":202,\"image\":{\"@id\":\"https:\/\/silicon-saxony.de\/en\/alixlabs-aps-demonstrated-on-300-millimeter-umc-wafers\/#primaryimage\"},\"thumbnailUrl\":\"https:\/\/cdn.pblzr.de\/dacbb27c-1270-4041-b681-e2b95f06f8a1\/2025\/04\/alixlabs-logo-400x300_TEXT.jpg\",\"keywords\":[\"Nanoelectronics\",\"Process Technologies\",\"Production\",\"Semiconductors\"],\"articleSection\":[\"Microelectronics\"],\"inLanguage\":\"en-US\"},{\"@type\":\"WebPage\",\"@id\":\"https:\/\/silicon-saxony.de\/en\/alixlabs-aps-demonstrated-on-300-millimeter-umc-wafers\/\",\"url\":\"https:\/\/silicon-saxony.de\/en\/alixlabs-aps-demonstrated-on-300-millimeter-umc-wafers\/\",\"name\":\"AlixLabs: APS\u2122 demonstrated on 300-millimeter UMC wafers - 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