{"id":17029,"date":"2023-05-08T13:19:40","date_gmt":"2023-05-08T11:19:40","guid":{"rendered":"https:\/\/silicon-saxony.de\/siemens-siemens-collaborates-with-tsmc-on-design-tool-certifications-for-tsmcs-advanced-technologies-and-other-industry-milestones\/"},"modified":"2023-06-15T11:05:28","modified_gmt":"2023-06-15T09:05:28","slug":"siemens-siemens-collaborates-with-tsmc-on-design-tool-certifications-for-tsmcs-advanced-technologies-and-other-industry-milestones","status":"publish","type":"post","link":"https:\/\/silicon-saxony.de\/en\/siemens-siemens-collaborates-with-tsmc-on-design-tool-certifications-for-tsmcs-advanced-technologies-and-other-industry-milestones\/","title":{"rendered":"Siemens: Siemens collaborates with TSMC on design tool certifications for TSMC\u2019s advanced technologies and other industry milestones"},"content":{"rendered":"

Today at the TSMC 2021 Online Open Innovation Platform\u00ae (OIP) Ecosystem Forum, Siemens Digital Industries Software announced that ongoing collaboration with longtime foundry partner TSMC has resulted in an array of new product certifications, and that the companies have reached key milestones for cloud-enabled IC design, as well as for TSMC 3DFabric\u2122, TSMC\u2019s comprehensive family of 3D silicon stacking and advanced packaging technologies.<\/strong>
\n\"\"
\nThe Siemens EDA offerings recently certified for TSMC\u2019s N3 and N4 processes include the Calibre\u00ae nmPlatform, Siemens\u2019 industry-leading physical verification solution for IC sign-off, as well as the Analog FastSPICE\u2122 Platform, which provides leading-edge circuit verification for nanometer analog, radio frequency (RF), mixed-signal, memory, and custom digital circuits. Siemens and TSMC have also been working closely on advanced process certifications for Siemens\u2019 Aprisa\u2122 place-and-route solution, to help assist joint customers achieve smooth and rapid silicon successes with Aprisa at the foundry\u2019s most advanced processes.<\/p>\n

"TSMC continues to develop innovative silicon processes that enable our mutual customers to bring to market many of the world\u2019s most advanced ICs," said Joe Sawicki, executive vice president, IC-EDA for Siemens Digital Industries Software.  "Siemens is proud to collaborate with TSMC to continue to deliver difference-making technologies that enable our mutual customers to deliver IC innovations to market more quickly."<\/p>\n

Siemens\u2019 commitment to supporting the latest TSMC processes also extends to the TSMC 3DFabric technology. The company has successfully completed the design requirements for TSMC\u2019s cutting-edge 3DFabric design flows. As part of the qualification process, Siemens enhanced its Xpedition\u2122 Package Designer (xPD) tool to support Integrated Fan-Out Wafer Level Packaging (InFO) design-rule handling with automated avoidance and correction. Calibre 3DSTACK, DRC and LVS are furthermore enabled and certified for the latest TSMC 3DFabric technologies, including InFO, CoWoS\u00ae, and TSMC-SoIC\u2122. For customers, these 3DFabric enablement milestones translate to shorter design and signoff cycles with fewer errors associated with manual interventions.<\/p>\n

Siemens has also partnered with TSMC to build a Design for Testability (DFT) flow for TSMC\u2019s 3D silicon stacking architecture. Siemens\u2019 Tessent\u2122 software provides a leading-edge DFT solution based on hierarchical DFT, SSN (Streaming Scan Network), enhanced TAPs (test access ports) and IEEE 1687 IJTAG (internal joint test action group) network technologies, all of which are IEEE 1838 compliant. Designed for scalability, flexibility and ease-of-use, the Tessent solution helps customers optimize resources associated with IC test technology.<\/p>\n

"Siemens continues to increase its value to the TSMC OIP ecosystem by offering more features and solutions in support of our most advanced technologies," said Suk Lee, vice president of the Design Infrastructure Management Division at TSMC. "We look forward to our continued collaboration with Siemens to help our mutual customers accelerate silicon innovations with design solutions combining Siemens\u2019 leading-edge electronic design automation (EDA) technologies with TSMC\u2019s latest process and 3DFabric technologies."<\/p>\n

Finally, Siemens\u2019 close collaboration with TSMC recently enabled the Calibre tools to demonstrate dramatic performance and scaling improvements for one of the world\u2019s foremost IC design firms within a leading cloud computing environment. Made possible by the optimization of the latest setup, decks and engine technologies for cloud environments within Calibre, these advancements can help joint customers realize faster time-to-tapeout and time-to-market. To learn more, please make plans to view Siemens\u2019 technical presentation during the TSMC 2021 Online OIP Ecosystem Forum.<\/p>\n

Siemens Digital Industries Software is driving transformation to enable a digital enterprise where engineering, manufacturing and electronics design meet tomorrow. The Xcelerator portfolio helps companies of all sizes create and leverage digital twins that provide organizations with new insights, opportunities and levels of automation to drive innovation. For more information on Siemens Digital Industries Software products and services, visit www.sw.siemens.com or follow us on LinkedIn, Twitter, Facebook and Instagram. Siemens Digital Industries Software \u2013 Where today meets tomorrow.<\/p>\n

Links<\/strong><\/em><\/p>\nwww.plm.automation.siemens.com
\nImage: Siemens<\/em><\/p>\n","protected":false},"excerpt":{"rendered":"

Today at the TSMC 2021 Online Open Innovation Platform\u00ae (OIP) Ecosystem Forum, Siemens Digital Industries Software announced that ongoing collaboration with longtime foundry partner TSMC has resulted in an array of new product certifications, and that the companies have reached key milestones for cloud-enabled IC design, as well as for TSMC 3DFabric\u2122, TSMC\u2019s comprehensive family of 3D silicon stacking and advanced packaging technologies.<\/p>\n","protected":false},"author":3,"featured_media":0,"comment_status":"closed","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"inline_featured_image":false,"footnotes":"","_links_to":"","_links_to_target":""},"categories":[4818],"tags":[1981,1952,1962,2010,1972,2004,1960],"class_list":["post-17029","post","type-post","status-publish","format-standard","hentry","category-microelectronics","tag-cleanroom","tag-electronics","tag-ic-design-en","tag-manufacturing","tag-nanoelectronics","tag-packaging-en","tag-semiconductor"],"acf":[],"yoast_head":"\nSiemens: Siemens collaborates with TSMC on design tool certifications for TSMC\u2019s advanced technologies and other industry milestones - 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