{"id":15736,"date":"2023-05-08T13:11:12","date_gmt":"2023-05-08T11:11:12","guid":{"rendered":"https:\/\/silicon-saxony.de\/nxp-nxp-collaborates-with-foxconn-on-next-generation-vehicle-platforms\/"},"modified":"2023-06-14T17:12:03","modified_gmt":"2023-06-14T15:12:03","slug":"nxp-nxp-collaborates-with-foxconn-on-next-generation-vehicle-platforms","status":"publish","type":"post","link":"https:\/\/silicon-saxony.de\/en\/nxp-nxp-collaborates-with-foxconn-on-next-generation-vehicle-platforms\/","title":{"rendered":"NXP: NXP Collaborates with Foxconn on Next Generation Vehicle Platforms"},"content":{"rendered":"<p><strong>NXP Semiconductors (NASDAQ: NXPI) today announced that it has signed a memorandum of understanding with Hon Hai Technology Group (&quot;Foxconn&quot;) to jointly develop platforms for a new generation of smart connected vehicles. Hon Hai (Foxconn), the world\u2019s largest electronics manufacturer and a leading technology solution provider, will leverage NXP\u2019s portfolio of automotive technologies and its longstanding expertise in safety and security to enable architectural innovation and platforms for electrification, connectivity and safe automated driving. The collaboration builds on the company\u2019s initial digital cockpit partnership, based on the NXP i.MX applications processors and NXP Software Defined Radio platform.<\/strong><br \/>\n<img loading=\"lazy\" decoding=\"async\" height=\"150\" width=\"300\" data-htmlarea-file-uid=\"3977\" src=\"https:\/\/cdn.pblzr.de\/dacbb27c-1270-4041-b681-e2b95f06f8a1\/2023\/05\/nxp-logo-300px.jpg\" style=\"\" alt=\"\"><br \/>\nThe primary focus of the expanded collaboration is aimed at Foxconn\u2019s efforts in electrical vehicle (EV) platforms, leveraging NXP\u2019s system expertise and comprehensive electrification portfolio, from NXP S32 processors to analog-front-end, drivers, networking and power products. Another innovation priority is connectivity solutions using the latest NXP S32 domain and zonal controller family for gateways and vehicle networking control, while also advancing secure car access with ultra-wideband (UWB) and Bluetooth Low Energy (BLE). A third pillar is safe automated driving augmented by NXP\u2019s leading radar solutions. NXP will also offer hardware and software support and will leverage the expertise of its well-rounded 3rd-party ecosystem in the areas of electrification, connectivity and automation.<\/p>\n<p>&quot;Foxconn sees the disruptive challenges and the potential for innovation in today\u2019s automotive industry. This is a prime opportunity for our particular electronics expertise. NXP\u2019s longstanding expertise and leadership in automotive, its innovative products and its laser focus on safety, security and quality provide the foundation for the collaboration we are activating today.&quot;<br \/><strong><em><br \/>&nbsp;Young Liu, Chairman of Foxconn<\/em><\/strong><br \/>&quot;We are proud to join forces with Foxconn today to support its ambitious leap into automotive and to jointly address the challenges and opportunities of a new generation of smart connected vehicles, especially Foxconn\u2019s new electric vehicle platform. The auto industry must become faster and more efficient, and NXP is pleased to extend its technology portfolio to enable electrification, next generation architectures, smart and secure car access systems and more.&quot;<\/p>\n<p><em>Kurt Sievers, President and CEO of NXP Semiconductors<\/em><br \/><em><strong><br \/>About NXP Semiconductors<\/strong><\/em><br \/>NXP Semiconductors N.V. (NASDAQ: NXPI) enables a smarter, safer and more sustainable world through innovation. As a world leader in secure connectivity solutions for embedded applications, NXP is pushing boundaries in the automotive, industrial &amp; IoT, mobile, and communication infrastructure markets. Built on more than 60 years of combined experience and expertise, the company has approximately 31,000 employees in more than 30 countries and posted revenue of $11.06 billion in 2021.<\/p>\n<p><em><strong>Links<\/strong><\/em><\/p>\n<link http:\/\/www.nxp.com=\"\" -=\"\" arrow-right=\"\">www.nxp.com&nbsp;&nbsp;<br \/>\n","protected":false},"excerpt":{"rendered":"<p>NXP Semiconductors (NASDAQ: NXPI) today announced that it has signed a memorandum of understanding with Hon Hai Technology Group (&#8220;Foxconn&#8221;) to jointly develop platforms for a new generation of smart connected vehicles. Hon Hai (Foxconn), the world\u2019s largest electronics manufacturer and a leading technology solution provider, will leverage NXP\u2019s portfolio of automotive technologies and its longstanding expertise in safety and security to enable architectural innovation and platforms for electrification, connectivity and safe automated driving. The collaboration builds on the company\u2019s initial digital cockpit partnership, based on the NXP i.MX applications processors and NXP Software Defined Radio platform.<\/p>\n","protected":false},"author":3,"featured_media":0,"comment_status":"closed","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"inline_featured_image":false,"footnotes":"","_links_to":"","_links_to_target":""},"categories":[4818],"tags":[1981,1952,1962,2010,1972,2004,1960],"class_list":["post-15736","post","type-post","status-publish","format-standard","hentry","category-microelectronics","tag-cleanroom","tag-electronics","tag-ic-design-en","tag-manufacturing","tag-nanoelectronics","tag-packaging-en","tag-semiconductor"],"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.1.1 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>NXP: NXP Collaborates with Foxconn on Next Generation Vehicle Platforms - Silicon Saxony<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/silicon-saxony.de\/en\/nxp-nxp-collaborates-with-foxconn-on-next-generation-vehicle-platforms\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"NXP: NXP Collaborates with Foxconn on Next Generation Vehicle Platforms - Silicon Saxony\" \/>\n<meta property=\"og:description\" content=\"NXP Semiconductors (NASDAQ: NXPI) today announced that it has signed a memorandum of understanding with Hon Hai Technology Group (&quot;Foxconn&quot;) to jointly develop platforms for a new generation of smart connected vehicles. Hon Hai (Foxconn), the world\u2019s largest electronics manufacturer and a leading technology solution provider, will leverage NXP\u2019s portfolio of automotive technologies and its longstanding expertise in safety and security to enable architectural innovation and platforms for electrification, connectivity and safe automated driving. 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