Co-organized with Fraunhofer IIS the workshop is an in-person event for automobile manufacturers, suppliers, semiconductor vendors, tool providers, research institutes, and other interested parties to exchange knowledge and experience in automotive electronics.<\/p>\n
The program covers the state of the art in chiplets, the OEM and tier-1 perspectives on the shift from mechatronics to hardware architectures supporting software flexibility, international approaches to new automotive architectures, and system engineering for seamless integration.<\/p>\n
Chiplets let system functions be split across multiple dies from different suppliers, combined in a single package. The approach allows different manufacturing nodes to be mixed, pre-validated blocks to be reused, and one architecture to scale across performance classes. For automotive use, it also raises questions that cut across supplier boundaries: how components are qualified, tested, and diagnosed across a vehicle lifetime, and what that means for tool chains, exchange formats, and system integration.<\/p>\n
The Program Committee welcomes presentation proposals and discussion topics to be sent by email to av4maas-chair@ieee.org . Your viewpoints are highly appreciated.<\/p>\n","protected":false},"featured_media":0,"template":"","meta":{"_acf_changed":false,"inline_featured_image":false,"_links_to":"","_links_to_target":""},"even_cat":[5043],"event_tag":[1906,1899,1901],"class_list":["post-547632","events","type-events","status-publish","hentry","even_cat-workshop","event_tag-automatisierung","event_tag-forschung-entwicklung","event_tag-halbleiter"],"acf":[],"yoast_head":"\n