{"id":541018,"date":"2026-05-29T14:46:00","date_gmt":"2026-05-29T12:46:00","guid":{"rendered":"https:\/\/silicon-saxony.de\/sisax-events\/3d-systems-summit-2026-2\/"},"modified":"2026-05-29T14:46:00","modified_gmt":"2026-05-29T12:46:00","slug":"3d-systems-summit-2026-2","status":"publish","type":"events","link":"https:\/\/silicon-saxony.de\/en\/sisax-events\/3d-systems-summit-2026-2\/","title":{"rendered":"3D &#038; Systems Summit 2026"},"content":{"rendered":"<p>The SEMI 3D and Systems Summit brings together semiconductor packaging leaders to explore the strategies and technologies driving next-generation heterogeneous systems integration.<\/p>\n<p>This year&#8217;s theme, <b>Enabling Next-Gen Heterogeneous Systems Integration<\/b>, focuses on exploring geopolitical dynamics, market trends, strategies to advance Europe&#8217;s next-gen semiconductor solutions, and the latest technological advancements.&nbsp;&nbsp;<\/p>\n<p>Expert-led sessions cover chiplet architectures, hybrid bonding, co-packaged optics, AI-driven system architectures, AR\/VR, and wearable intelligence, with a strong focus on Europe&#8217;s role in advancing design leadership, materials innovation, and the transition from lab to fab.<\/p>\n<p>The <b>exclusive exhibition area<\/b> showcases industry leaders alongside innovative emerging companies, providing a platform for gathering and exchanging knowledge and foster collaborations.\u202f<\/p>\n<p>Attendees will have several opportunities for B2B matching, including networking receptions, coffee breaks, lunches, and a unique <a href=\"https:\/\/exclusivegermany.com\/destinations\/dresden\/elbe-river-cruise\/\" target=\"_blank\">Networking Dinner Cruise<\/a> along the beautiful Elbe River.&nbsp;&nbsp;<\/p>\n<p><b>WHAT YOU CAN EXPECT<\/b><\/p>\n<ul>\n<li>Three days of focused technical exchange on advanced packaging and heterogeneous integration<\/li>\n<li>Expert keynotes and panels addressing the industry\u2019s most critical challenges<\/li>\n<li>Sessions covering chiplet architectures, hybrid bonding, co-packaged optics, AI systems, AR\/VR and wearable intelligence<\/li>\n<li>Exclusive exhibition featuring industry leaders and innovative emerging companies<\/li>\n<li>B2B matchmaking and networking formats designed to connect you with the right people<\/li>\n<li>Direct access to engineers, researchers, product leaders and decision-makers<\/li>\n<li>A unique Networking Dinner Cruise along the Elbe River<\/li>\n<li>Organised by SEMI Europe, the global industry association for the electronics supply chain<\/li>\n<\/ul>\n<p><b><br \/>TOPICS<\/b><br \/>From chiplet architectures and hybrid bonding to co-packaged optics, AI-driven system design, AR\/VR, wearable intelligence, and Europe\u2019s semiconductor sovereignty, the 3D &amp; Systems Summit connects deep technical expertise with strategic industry perspectives.<\/p>\n<p><b>WHO SHOULD ATTEND<\/b><br \/>Semiconductor packaging engineers, process technologists, system architects, R&amp;D leaders, product managers, researchers, and business decision-makers from across the heterogeneous integration and semiconductor ecosystem.<\/p>\n<p><b>REGISTRATION<\/b><br \/>Delegate Ticket Prices:<\/p>\n<ul>\n<li>SEMI Members: \u20ac1,195 (excl. 19% German VAT)<\/li>\n<li>Non-members: \u20ac1,695 (excl. 19% German VAT)<\/li>\n<\/ul>\n<p>Delegate Ticket Includes:<\/p>\n<ul>\n<li>Conference sessions and keynote presentations<\/li>\n<li>Exhibition access<\/li>\n<li>Coffee breaks and lunches<\/li>\n<li>Networking Reception (June 17)<\/li>\n<li>Networking Dinner Cruise (June 18)<\/li>\n<\/ul>\n","protected":false},"featured_media":0,"template":"","meta":{"_acf_changed":false,"inline_featured_image":false,"_links_to":"","_links_to_target":""},"even_cat":[266],"event_tag":[1898,5118,2747,5172,4874],"class_list":["post-541018","events","type-events","status-publish","hentry","even_cat-conference","event_tag-industrial-internet-of-things","event_tag-research-development","event_tag-semiconductor","event_tag-system-design","event_tag-technological-sovereignty"],"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.1.1 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>3D &amp; Systems Summit 2026 - Silicon Saxony<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/silicon-saxony.de\/en\/sisax-events\/3d-systems-summit-2026-2\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"3D &amp; Systems Summit 2026 - Silicon Saxony\" \/>\n<meta property=\"og:description\" content=\"The SEMI 3D and Systems Summit brings together semiconductor packaging leaders to explore the strategies and technologies driving next-generation heterogeneous systems integration. This year&#8217;s theme, Enabling Next-Gen Heterogeneous Systems Integration, focuses on exploring geopolitical dynamics, market trends, strategies to advance Europe&#8217;s next-gen semiconductor solutions, and the latest technological advancements.&nbsp;&nbsp; Expert-led sessions cover chiplet architectures, hybrid...\" \/>\n<meta property=\"og:url\" content=\"https:\/\/silicon-saxony.de\/en\/sisax-events\/3d-systems-summit-2026-2\/\" \/>\n<meta property=\"og:site_name\" content=\"Silicon Saxony\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data1\" content=\"2 minutes\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\/\/schema.org\",\"@graph\":[{\"@type\":\"WebPage\",\"@id\":\"https:\/\/silicon-saxony.de\/en\/sisax-events\/3d-systems-summit-2026-2\/\",\"url\":\"https:\/\/silicon-saxony.de\/en\/sisax-events\/3d-systems-summit-2026-2\/\",\"name\":\"3D & Systems Summit 2026 - Silicon Saxony\",\"isPartOf\":{\"@id\":\"https:\/\/silicon-saxony.de\/en\/#website\"},\"datePublished\":\"2026-05-29T12:46:00+00:00\",\"breadcrumb\":{\"@id\":\"https:\/\/silicon-saxony.de\/en\/sisax-events\/3d-systems-summit-2026-2\/#breadcrumb\"},\"inLanguage\":\"en-US\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\/\/silicon-saxony.de\/en\/sisax-events\/3d-systems-summit-2026-2\/\"]}]},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\/\/silicon-saxony.de\/en\/sisax-events\/3d-systems-summit-2026-2\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\/\/silicon-saxony.de\/en\/home\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"Events\",\"item\":\"https:\/\/silicon-saxony.de\/en\/sisax-events\/\"},{\"@type\":\"ListItem\",\"position\":3,\"name\":\"3D &#038; Systems Summit 2026\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\/\/silicon-saxony.de\/en\/#website\",\"url\":\"https:\/\/silicon-saxony.de\/en\/\",\"name\":\"Silicon Saxony\",\"description\":\"Germany&#039;s Hightech Network - Semiconductors, Software, Robotics\",\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\/\/silicon-saxony.de\/en\/?s={search_term_string}\"},\"query-input\":{\"@type\":\"PropertyValueSpecification\",\"valueRequired\":true,\"valueName\":\"search_term_string\"}}],\"inLanguage\":\"en-US\"}]}<\/script>\n<!-- \/ Yoast SEO plugin. -->","yoast_head_json":{"title":"3D & Systems Summit 2026 - Silicon Saxony","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/silicon-saxony.de\/en\/sisax-events\/3d-systems-summit-2026-2\/","og_locale":"en_US","og_type":"article","og_title":"3D & Systems Summit 2026 - Silicon Saxony","og_description":"The SEMI 3D and Systems Summit brings together semiconductor packaging leaders to explore the strategies and technologies driving next-generation heterogeneous systems integration. 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