{"id":4930,"date":"2023-01-03T16:27:13","date_gmt":"2023-01-03T15:27:13","guid":{"rendered":"https:\/\/silicon-saxony.de\/arbeitskreise\/test-analysis-reliability\/"},"modified":"2025-10-28T09:26:34","modified_gmt":"2025-10-28T08:26:34","slug":"test-analysis-reliability","status":"publish","type":"arbeitskreise","link":"https:\/\/silicon-saxony.de\/en\/working-groups\/test-analysis-reliability\/","title":{"rendered":"Test, Analysis & Reliability"},"content":{"rendered":"
Microelectronics<\/a><\/div>

Test, Analysis & Reliability<\/h1>\n<\/div><\/div>

The working group “Test, Analysis & Reliability” supports the technical communication between industry, research institutions and educational institutions in the fields of electrical and physical analysis, modeling as well as verification of the reliability and lifetime determining properties of individual components and systems. In addition to the targeted transfer of knowledge, the focus is also on the networking of experts.<\/p>\n

With the help of the open technical exchange, the working group thus initiates impulses for methodology and device development between users and developers. In addition to these subject-specific aspects, the working group is also concerned with engineering and science-specific training and the further training of specialists in the field.<\/p>\n<\/div><\/div>

WORKING GROUP LEADER<\/p>\n<\/div><\/div>

\"Bild<\/div><\/div>

Prof. Dr. rer. nat. Michael Beck<\/strong>
\nBrandenburgische Technische Universit\u00e4t
\n+49 3573 85 523<\/a>
\nmichael.beck@b-tu.de<\/a><\/p>\n<\/div><\/div>\n<\/div><\/div>

WORKING GROUP LEADER<\/p>\n<\/div><\/div>

\"Bild<\/div><\/div>

Dr. Werner Prischmann
\n<\/strong>RoodMicrotec GmbH
\n+49 351 2511 659<\/a>
\nwepri@arcor.de<\/a><\/p>\n<\/div><\/div>\n<\/div><\/div><\/div><\/div><\/div>